Equipment Name

Equipment Diagram

Can undertake test items

According to the standard

3D optical microscope

Used for appearance inspection, can be displayed in 2D and 3D

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X-RAY

Used for observing package bonding wire, chip loading, void, delamination, etc.

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Laser Decap

Peel off the plastic seal of the sample

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Section Cutting Machine

Use a cutting machine to cut the sample to the appropriate size

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Section grinding and polishing machine

The samples are grinded with sandpaper (or diamond sandpaper) of different thicknesses

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SEM+EDX

Used to observe the short circuit, open circuit, electromigration, pinholes and corrosion of the metal leads on the surface of the chip; it can be used to observe the stacking fault, dislocation of the silicon wafer and the size measurement of the pattern line; it can be used to analyze the product failure Elements of points.

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X fluorescence spectrometer

Professional fast detector for environmentally harmful elements

IEC62321
GB/T26125-2011