About Us
Having a mature core team, possessing comprehensive technological innovation capabilities, and a good market source
Reliability Test
Device Name |
Equipment Diagram |
Capable of undertaking experimental projects
|
According to the standard |
3D optical microscope |
 |
For visual inspection, supports 2D and 3D display. |
/ |
X-RAY |
|
For observing packaging wire bonding, die attach, voids, delamination and other defects. |
/ |
Laser Decap |
|
Peel off the plastic outer adhesive of the sample and remove it |
/ |
Sectional cutting machine |
|
Use a cutting machine to cut the sample into appropriate sizes |
/ |
Sectional grinding and polishing machine |
|
Grind the sample with sandpaper of different thicknesses (or diamond sandpaper) |
/ |
SEM+EDX |
 |
Used to observe short circuits, open circuits, electromigration, pinholes in oxide layers, and corrosion of metal leads on the surface of chips; Can be used to observe layer faults, dislocations, and measure the size of graphic lines in silicon wafers; Elements that can be used to analyze product failure points. |
/ |
X-ray fluorescence spectrometer |
 |
Professional rapid detection instrument for environmentally harmful elements |
IEC62321 GB/T26125-2011 |
Follow Us
Contact Us
Address: Building 8, Ganquan Ecological Science Park, Hanjiang District, Yangzhou City
Telephone:0514-87178001
Personnel mailbox:hr@wdsemi.com
Sales mailbox:sales2@wdsemi.com
Website:www.wdsemi.com